Miniaturization Technology


Shown is an animated representation of how Sound Design Technologies' HDI substrates and BST capacitor chips can be used with advanced assembly capabilities to package multiple ICs in an miniaturized stacked chip architecture.




By utilizing the 3rd dimension integrated passive components and ICs can be stacked closer together which not only provides miniaturization but also improves electrical performance by decreasing signal distances. Capacitor networks can be connected in ultra-close proximity to critical IC nodes by flip chipping the IC(s) directly onto a capacitor chip while high performance vertical interconnect structures can be used to connect multiple sub-module levels.



Packaging Layers:

• Chip Stacking
• 3-D MCM
• S-CSP

Contact us to let us know your packaging needs:

Technology Services

Phone: +1 (905) 635-0804 ext 1740
Fax: +1 (905) 631-5724
Email: techservices@sounddes.com