Backend Finishing

Backend finishing services include wafer level thinning, wafer/die level bumping, dicing and packaging. Access to DBG (dice before grind) technology allows die to be thinned down to less than 100um with no backside chipping. Stud bumping capability enables probed wafers or individual die to be gold bumped for flip chip processing.

Other wafer level bumping and thinning processes are also available.



Wafer Thinning:

• 4" - 12" wafers down to 100um (singulated with no backside chipping).

Bumping:

• Wafers or individual die (stud bumped) stud bumping (planarized 60 - 90um diameter bumps).

Dicing:

• High precision wafer singulation.

Packaging:

• Into waffle packs (other carrier types).