Sound Design Technologies continues to pioneer the development of unique technologies that have made us a world leader in advanced packaging solutions for the micro-electronics industry. Driven by the miniaturization needs of the hearing aid market these capabilities are also ideally suited to a wide variety of other applications where smaller size, cost effective performance, and integration are critical.


Whether your need is a customized component such as a tunable BST capacitor network or a completely integrated 3D MCM packaging solution (SiP) the technology products and services group offers a full suite of capabilities designed to meet your needs at every level. With quick turn prototyping, design, test and simulation support a fully comprehensive service is provided.






Contact us to let us know how we can meet your technology needs:

Technology Services

Phone: +1 (905) 635-0804 ext 1740
Fax: +1 (905) 631-5724
Email: techservices@sounddes.com