ON Semiconductor continues to pioneer the development of unique technologies that have made us a leader in advanced packaging solutions for the micro-electronics industry. Driven by the miniaturization needs of the hearing aid market, these capabilities are also ideally suited to a wide variety of other markets and applications where small size, cost effective performance, and system integration are critical.
Whether your need is for a customized component such as a high-density thin film capacitor array network or an fully integrated 3D System-in-Package (SiP)solution the technology products and services group offers a full suite of capabilities designed to meet your needs, from design and test right through to volume manufacturing.
Contact us to let us know how we can meet your technology needs:
