Sound Design Technologies Ltd is a leading designer and manufacturer of ultra-low power semiconductor solutions for hearing instruments, and a leading provider of advanced high density interconnect technologies used in custom miniaturized 3D Multi-Chip Modules (MCM), System-In-Package (SIP) and Stacked Chip Scale Packages (S-CSP). Founded in 2007 via the acquisition of Gennum Corporation's Audio Division and Manufacturing Operations, Sound Design Technologies Ltd is headquartered in Burlington, Ontario, Canada with additional design, research and development offices in Ottawa, Ontario, Canada.

Capitalizing on our audio and acoustic expertise, we provide a broad portfolio of products including digital signal processors (DSPs), capacitors and radio frequency (RF) components for wireless headsets, hearing devices and professional audio equipment. Our deep knowledge of ultra-low power DSP, low power wireless, noise cancellation and thin film manufacturing enables us to deliver best-in-class solutions for miniaturized battery powered applications. Our portfolio includes a full range of deep sub-micron product development capabilities including ultra low-power Analog Design, Digital ASIC Design and Hearing-Aid Algorithm Development.

Sound Design Technologies' (SDT) internal manufacturing and test capabilities service our Hearing Products and well as provide contract manufacturing for customers requiring ultra miniature System in Package (SiP) stacked devices. The major functions supported by the Manufacturing Operations include: Wafer Fabrication, Packaging Operations and Test Operations.

SDT is registered to the ISO 9001:2000, ISO 14001:2004 and OHSAS 18001:1999 international Quality, Environmental and Occupational Health and Safety standards. The company is also committed to comply with global environmental initiatives and offers "Lead-Free" and "Green" product versions for all its markets.